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FEATURES AND SPECIFICATIONS
1.20 by 2.00mm (.047 by .079") Pitch HD MezzTM Connectors 45802 HD MezzTM Receptacle 45830 HD MezzTM Plug
Simplify PCB routing, maximize card-slot space and achieve speeds up to 12.5 Gbps with Molex's HD Mezz; designed for the large and growing high-density and high-performance mezzanine connector market The High Density Mezzanine (HD Mezz) board-toboard connector is designed for computer, networking, telecommunications, storage and general market applications with high pin-count devices on mezzanine or module printed circuit boards (PCBs). This design provides a flexible tooling approach that allows for multiple stack heights and circuit-size extensions. HD Mezz provides many benefits. It allows customers to simplify PCB routing without sacrificing performance, avoid the expense of large complex multi-layer boards and utilize space more efficiently within a given card slot area. Option cards may be added or upgraded to increase flexibility in design, production and testing. The HD Mezz design has superior electrical and mechanical features that are cost competitive. The Molex patented solder-charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products.
Left to right: HD Mezz Receptacle (Series 45802) and HD Mezz Plug (Series 45830)
Features and Benefits n Molex's patented solder attach method is more cost effective and reliable than Ball Grid Array (BGA) connector attach methods n Data rates up to 12.5 Gbps for excellent signal clarity with ample bandwidth for customer requirements in high-speed designs n Stack heights ranging from 16.00 to 38.00mm (.630 to 1.496") and circuit sizes of 91 to 403 circuits provides ease in design based on engineering constraints in system envelopes n Highest contact density on the market with 14 differential pairs per cm2 is extremely useful for space constrained designs with limited PCB real estate n Reliable mating interface with 2.00mm (.079") wipe and two points of contact with sufficient conductive wipe for clean signal transmission and enhanced durability
SPECIFICATIONS Reference Information Product Specification: PS-45802-001 Packaging: Tray UL File No.: TBD CSA File No.: TBD Designed in: Millimeters Electrical Voltage: 250V AC per contact Current: 2.0A per contact Contact Resistance: 25 milliohms nominal Dielectric Withstanding Voltage: 500V DC Insulation Resistance: Across Wafers - 5000 Megohms min. Within Wafers - 1000 Megohms min. Mechanical Mating Force: 51g nominal per contact Unmating Force: 25g nominal per contact Normal Force: 51g nominal per contact Durability: 100 cycles Physical Housing: Glass-filled LCP, UL 94V-0 Contact: Copper (Cu) alloy Plating: Contact Area - 0.75m Gold (Au) min. Solder Tail Area - 2.50m Tin (Sn) min.* Underplating - 1.25m Nickel (Ni) overall Operating Temperature: -55 to +105C
*Please contact Molex Customer Service for lead-free solder tail plating options
APPLICATIONS
1.20 by 2.00mm (.047 by .079") Pitch HD MezzTM Connectors 45802 HD MezzTM Receptacle 45830 HD MezzTM Plug
n High and mid-range computers - Servers n Medical - Scanning equipment n Military n Networking and telecommunications - Network routers and switches - Mobile base stations
Mezzanine card for a customer application with one and two HD Mezz assemblies per card
ORDERINg INFORMATION
Order No. (Lead-free) Order No. (Tin-Lead) Component Circuits Height
45802-0311 45802-0215 45802-0223 45802-1211 45802-1223 45802-1225 45830-0215 45830-0223 45830-2211 45830-2223 45830-2225 45830-1211
45802-0011 45802-0015 45802-0123 45802-1011 45802-1123 45802-1025 45830-0015 45830-0023 45830-2011 45830-2023 45830-2025 45830-1111 Plug Receptacle
143 195 299 143 299 325 195 299 143 299 325 143 18.00mm (.708") 10.00mm (.393") 8.00mm (.314") 18.00mm (.708") 8.00mm (.314")
Please contact Molex Customer Service for additional circuit sizes and stack heights
Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com
Order No. 987650-1132
Asia Pacific North Headquarters Asia Pacific South Headquarters European Headquarters Yamato, Kanagawa, Japan Jurong, Singapore Munich, Germany 81-46-265-2325 65-6268-6868 49-89-413092-0 apninfo@molex.com fesinfo@molex.com eurinfo@molex.com Visit our website at www.molex.com/product/hdmezz.html
Printed in USA/JI/2007.12
Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352
(c)2007, Molex

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